Mocon, a manufacturer of permeation instrumentation, has announced a new capability for its OpTech – O2 system.
Non-invasive, non-destructive thermoformed blister package testing is now possible due to the development of an optical sensor that will ‘fluoresce’ or give off light directly related to the amount of oxygen present. OpTech – O2 technology is ideal for determining oxygen headspace and ingress in flexible and rigid packaging, the firm says.
‘Some blister packaging applications depend on gas flushing to enhance the product’s shelf life. However, poor packaging seals, material breakdown, weak barrier properties, or pinholes can compromise modified atmosphere. This is why using a precise and sensitive package performance test method is so important –especially for drug packaging,’ said Ed Emerson, manager of healthcare business development at Mocon.
In the past, blister testing alternatives either involved invasive testing or complicated off-line procedures. Mocon says other blister testing procedures are labour intensive, or without the degree of accuracy that the OpTech – O2 system provides.
‘This breakthrough technology will have a dramatic impact on how pharmaceutical companies conduct oxygen analysis,’ explained Emerson.
‘The OpTech – O2 system offers a simple method to quickly evaluate what is happening inside a closed blister package under real-life conditions.’
Mocon adds blister package testing to OpTech – O2 system
Firm says it will have a dramatic impact on oxygen analysis
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